Wire bonding services is a specific method of producing electrical interconnections through the use of solid-phase welding. It combines fine wire together with pressure. The choice of energy is either heat or ultrasonic energy. The goal is to establish specific interconnections between integrated circuits e.g. semiconductors, and a silicon chip.
In wire bonding, two types remain the most common. These are:
1. Ball Bonding: The technique employed is thermosonic bonding. It melts the end of the wire to create a ball shape, aka free-air ball. The material most frequently used is gold. However, more recently, a shift has been made to copper.
2. Wedge Bonding. The technique for this type of wire bonding is ultrasonic. It involves a clamped wire coming into contact with a bond pad. The application of ultrasonic energy creates the initial wedge bond. The most common material employed is aluminum.
No matter the material, ball bonding is the most popular type. Since it is unidirectional, ball bonding is faster than ultrasonic wedge bonding.
Wire bonding is a common means of producing electrical interconnections for various devices. While wedge bonding is common, the most popular technique is ball bonding. While wedge bonding tends to utilize aluminum, until recently, the favored metal for ball bonding was gold. Copper is on the rise in this method in an attempt to ensure cost-effectiveness. This has resulted in some worries being raised about the reliability of the final product. Copper, after all, is less hard and more susceptible to corrosion.